Blue Low Thermal Impedance Thermal Adhesive Tape for Bonding Heat Dissipation

Product Categories

Phase Changing Materials [38]
Thermal Conductive Pad [155]
Thermal Gap Filler [189]
Thermal Conductive Grease [27]
Thermal Insulation Materials [46]
Thermal Graphite Sheet [53]
Thermal Adhesive Tape [47]
Thermal Conductive Glue [15]
Thermal Conductive Adhesive [13]
Thermal Conductive Plastic [23]
Sponge Foam Material [13]
PET Double Sided Tape [11]
Thermal Gap Pad [406]
Thermal Conductive Gel [22]
Silicone Foam Gasket [11]
Silicone Free Gap Filler Pad [13]
Shielding Absorbing Materials [19]
Thermal Conductivity Sharp Metal [2]

Dongguan Ziitek Electronic Materials & Technology Ltd.

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

Dongguan Ziitek Electronic Materials & Technology Ltd.

Visit Website

City: Dongguan

Province/State: Guangdong

Country/Region: China

View Contact Details

Blue Low Thermal Impedance Thermal Adhesive Tape for Bonding Heat Dissipation

Contact Now

Blue Low Thermal Impedance Thermal Adhesive Tape for Bonding Heat Dissipation

Blue Low Thermal Impedance Thermal Adhesive Tape for Bonding Heat Dissipation Fins 10" x 400' Sizes The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and ...

Product Tags:

adhesive foam tape

thermally conductive adhesive tape

Blue Thermal Adhesive Tape

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	Dongguan Ziitek Electronic Materials & Technology Ltd.
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!